我们的客户是一家美资500强企业，专业生产制造连接器线束等产品

Responsibilities:

· Define PCB material and design PCB stack-up, create Signal Integrity pre-layout and post-layout.

· Perform specific SI simulation to do it right at first time and eliminate risks within very tight schedule.

· Perform signal integrity measurement or simulation to analyze and support external and internal customers and team members.

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Requirement:

· 1.Bachelor of Science in engineering or related fields

· 2.Understand signal integrity parameters and evaluate trade-offs between design parameters to determine an optimum solution specification range

· 3.8 years or above work experience of high speed CHIPs and PCBA development, SI simulation software, board design and hardware debugging experience

· 4.Familiar with lab instruments such as scopes, TDRs, VNAs, and so on

· 5.Proven result driven performances and able to work independently under pressure6.Fluent English in writing, speaking , listening and reading