Job Responsibility:
1. Be responsible for the failure analysis of Power Integrated Module, guide the direction of analysis, find out the root cause and promote improvement.
2. Be the FA lab technical leader to develop new FA technology and enhance FA lab capability.
3. Guide FA team perform physical/electrical failure analysis on assembly level and die level using FA solutions, include microscope inspection(OM,SEM,PEM/OBIRCH) ,non-destructive method(curve tracer, x-ray, SAT,EDS) and destructive method(decap, cross section, FIB).
Job Requirements:
1. Bachelor Degree or above, Material Engineering or Electrical Engineering.
2. 3 years FA experience or above, in depth FA analysis experience for semiconductor product such as PIM or IGBT module.
3. Able to resolve complex failure issues and lead cross-functional teams.
4. Fine communication ability with other departments and customers, strong team spirit.
5. Good written and spoken English.
邮件发送成功
订阅失败
您的订阅已超过上限,如需继续订阅,请在 订阅管理 中至少停用1条订阅。
查看地图
前往高德地图查看
使用微信“扫一扫”
打开网页后点击右上角“分享按钮