Position Overview:        

TE Connectivity‘s R&D/Product Development Engineering Benchmark center is part of the shared engineering analysis team in charge of Benchmark Analyst of sensor products. Responsibilities will include performance test, reverse analysis, cost analysis and comparative analysis with competitive products of sensor products. The Benchmark Analyst will deliver a comprehensive benchmark analysis report with supporting images, charts and data to support all analytical conclusions, as well as interact with design teams and PM teams, as needed in expedite the design of new designs and resolve critical product/ customer issue, and study new technology, design concept, including MEMS, components, cost etc.

Responsibilities & Qualifications: 

Responsibilities in Benchmark

Define and document the critical inputs for benchmark

Identify the type, material application and design concept of the evaluated product.

Interface with product designers to offer advice/guidance on technical matters relating to the performance of product

Create customized reports, prepare presentation materials, conduct analysis meetings, and share new technologies and design ideas

Communicate as requested with product designers to explain report results and the rationale behind proposed product improvements

Plan an active role in NPI, Sustaining and Advanced Development projects

Traits : 

Rigorous and responsive, and have good analytical and problem solving skills

Organized and efficient

Excellent in generating output reports for reverse engineering

Strong sense of commitment to deliver tasks on time

A solid team player who understands the importance of analysis as part of the cross functional team

Fluent in English

Comfortable working in a fast-paced environment

Education and Experience

Material, Electronic or Mechanical Engineering Bachelor degree or above

Minimum of 5 years of experience in product design, tear down or failure analysis

Theoretical & practical knowledge of product and/or process development

Background in Sensor development - Mechanical or electrical design with mixed signal electronics preferred

Demonstrated experience in working as team and across regions / time zones

Curiosity to understand, and ability to address and solve new problems is required

Ability to build strong, credible relationships with multiple organization functions inside TE and outside (i.e. customers and suppliers)

Sufficient experience in performance test/structure analysis of the sensor

 Strong skill in Micro-analysis and failure analysis is a must (SEM/EDS, FTIR, Resin encapsulation and polishing)

Proficient skill in tear down and Thermal analysis (wire saw, FIB, PFIB, Chemical opening, Gravimetric, DSC, TGA, TMA)

Capability to make results comparison between products from different manufacturers