Our client is the leader in innovative high-performance mixed signal solutions which, combined with deep application insight, enable the secure connections needed for a smarter world.

Responsibilities:

- Lead and develop the Innovation “Process and Materials” competencies team with very complex projects

- Coach/Mentor other staff supporting less complex projects 

- Drive in a timely manner the definition, selection, development, qualification and transfer to production, all new materials and second sourcing activities 

- Define, select, develop, qualify and transfer new processes for packaging assembly and test in a timely manner that meet, the quality, cost, yield and manufacturability requirements  

- Participate and contribute in cost reduction and quality improvement activities 

- Provide technical support in trouble shooting problems

- Communicate and collaborate with cross-functional team members and stakeholders

- Manage external consultants (eg university) projects 

- Staying abreast of new technology and potential application for NXP, conduct feasibility analysis, technical risk assessments and competitor analysis.  Contribute to package design rule and package technology roadmap 

Requirements:

- Minimum Bachelor degree. Preferred with Master Degree in Sciences or Engineering.

- At least 10 years semiconductor or semiconductor packaging development experience.

- Familiarity with intellectual property development procedures

- Strong problem solving skills (eg. 6 Sigma Black belt)

- Computer literature and knowledgeable in copper wire bonding technology.

- Excellent communication and collaboration skills

- Fluent written and oral English